LDS (Laser direct structuring) Thermocomp DX14354X

LDS (Laser direct structuring) Thermocomp DX14354X

Model No.︰PC+ABS NX11302

Brand Name︰Laser direct structuring(LDS)

Country of Origin︰China

Unit Price︰US $ 0.01 / KG

Minimum Order︰25 KG

Inquire Now

Product Description

LDS (Laser direct structuring) materials: 

 

PC/ABS BASED

LNP THERMOCOMP NX07354
This is a PC/ABS compound, a good candidate for Laser Direct Structuring applications.

LNP THERMOCOMP NX11302
Polycarbonate + ABS compound with colorable, good plating, surface and mechanical performance, a good candidate for Laser Direct Structuring applications.
.
XANTAR LDS 3710
Laser Direct Structuring (LDS)*, Vicat 120°C, Black color only

 

PC BASED

XANTAR LDS 3730

Flame retardant(halogen free),black color only,LDS.

,

LNP THERMOCOMP Compound DX06313I
30% glass fiber reinforced, impact modified polycarbonate resin. High flow and good ductility.
,

LNP THERMOCOMP Compound DX10311 
30% glass fiber reinforced, impact modified polycarbonate resin. High flow and good ductility.
,

 

LNP THERMOCOMP Compound DX13354

New PC copolymer, Glass, Impact Modified, LDS function

,

LNP THERMOCOMP Compound DX13354X

New PC copolymer, Glass, Impact Modified, LDS function, Colorable

,

LNP THERMOCOMP Compound DX14354X

improved flow, colorable compound based on PC copolymer resin developed for applications that require LDS for antenna, or electronic circuit manufacturing.

,

LNP THERMOCOMP Compound DX15354

New PC copolymer, Glass, Impact Modified, LDS function

,

 

LNP THERMOCOMP Compound DX11354

This is a PC compound with good plating, surface and mechanical performance, a good candidate for Laser Direct Structuring applications

,

LNP THERMOCOMP Compound DX11354X 

a colorable PC based compound with stable plating and RF performance, colored LDS material solution, good surface and processing window, high impact strength. It is a general purpose product available in internal and external parts for Laser Direct Structuring applications.

,

LNP THERMOCOMP Compound DX11355

This is a PC based compound with good plating, surface, mechanical performance and flame retardant (Halogen free), a good candidate for Laser Direct Structuring applications.

,

 

PPA BASED

LNP THERMOCOMP Compound UX08325

PPA base glass fiber filled compounds, good for LDS application. Additional feature is high heat. 

,

LCP BASED

Celanese Vectra LCP E840i LDS  (MID/LDS),Plateable.

LNP THERMOCOMP INVENTORY LIST
Type Color No. Material Origin Available
DX109110 WH96163 PC CHINA 1,000 kg
DX13354 701 PC China 2,000 kg
NX07354 BKNAT PC+ABS China 5,000 KG
DX10311 701 PC-GF30 China 1,000 kg
NX11302 WH9E641 PC+ABS China 5,000 kg
         
         
         
         
         
         
DX06313I 701 pc-gf30 China 1,000 kg

*The compound is intended specifically for the use in the process of manufacturing conducting path designs according to the German application of the patent 101 32 092 of LPKF Laser & Electronics AG. Please address straight to LPKF Laser & Electronics AG (www.LPKF.de).

**Any questions e-mail to:x.g.chiang@gmail.com 

Price Terms︰ EXW/CIP/FOB/CIF

Payment Terms︰ T/T

Packing︰ 25KG/BAG

Lead Time︰ 5 DAYS

Product Image